History of Parylene
Parylene development started in 1947, when Michael Szwarc discovered the polymer as one of the thermal decomposition products of a common solvent p-xylene at a temperature between 700 and 900 °C. Szwarc first postulated the monomer to be para-xylylene which he confirmed by reacting the vapors with iodine and observing the para-xylylene di-iodide as the only product. The reaction yield was only a few percent, and a more efficient route was found later by William F. Gorham at Union Carbide. He deposited parylene films by the thermal decomposition of di-p-xylylene at 550 °C and in vacuum below 1 Torr. This process did not require a solvent and resulted in chemically resistant films free from pinholes. Union Carbide commercialized a parylene coating system in 1965.
Parylene is widely used for: Abrasion protection Aerospace and Aviation Electronics Barrier layers Corrosion protection for metallic surfaces Electronic Components Glass Hydrophobic coating LEDS Medical Devices and Instruments MEMS Microwave electronics Military and Defense Parts Nanotech Protection of plastic, rubber Rare Earth Magnets Reduction of friction Reinforcement of micro-structures Semiconductor Products Sensors in rough environment Silicone Gaskets Wire and Cable