Parylene
Engineering offers two
commercial Parylene variants,
each having its own unique
electrical and physical
properties. Contact the Para
Tech engineering department for
assistance with material
selection as well as
determination of film thickness
and substrate preparation
requirements.
Parylene C
Differs chemically, having a chlorine atom
on the benzene ring that results in a useful
combination of electrical and physical
properties including particularly low
moisture and gas permeability. This version
deposits on substrates faster is than
Parylene N, with a consequent reduction in
crevice penetration activity.
Parylene N
Has the highest dielectric strength of the
three versions, and a dielectric constant
value independent of frequency. It is able
to penetrate crevices more effectively than
the other two versions because of the higher
level of molecular activity that occurs
during deposition. Parylene N is commonly
used in high frequency applications because
of its low dissipation factor and dielectric
constant values.
Parylene D
Maintains its
physical strength and
electrical properties at
higher temperatures.
